EMS is official Add-on Contributor to EPFL's new release on 3D-ICE

3D-­ICE, or “3D Interlayer Cooling Emulator”, is a Linux based generic simulation platform written in C to simulate the transient thermal behavior of 3D IC structures with inter-tier microchannel heat sinks.

It is intended for performing thermal analysis of 2D or 3D ICs during early stages of VLSI circuit/architecture design by electronic engineers. The SystemC/TLM2.0 coupling of 3D-ICE enables thermal simulations for ESL virtual platforms. This feature is used in our DRAM design space exploration framework DRAMSys within the 3D-DRAM DFG Project (http://www.uni-kl.de/3d-dram/home/).

The simulator has been developed and is being maintained by the Embedded Systems Laboratory of the École Polytechnique Fédérale de Lausanne (EPFL), Switzerland. For further information on 3D-ICE, please refer to the project's website.