Lukas Krupp, Dr.-Ing.
Anschrift
Erwin-Schrödinger-Straße
Gebäude 12, Raum 213
67663 Kaiserslautern
Kontakt
Telefon: (+49) 631 / 205-3434
Fax: (+49) 631 / 205-4437
Email: lukas.krupp(at)rptu.de
Forschungsgebiete
- Digital Signal Processing
- Embedded Machine Learning
- LLMs for Electronic Design Automation
Lehrveranstaltungen
Publikationen
CRADLE: Conversational RTL Design Space Exploration with LLM-based Multi-Agent Systems
L. Krupp, M. Schöffel, E. Biehl, N. Wehn. Accepted for Publication, 22nd International SoC Conference (ISOCC 2025), October, 2025, Busan, South Korea.
Improving Chip Design Productivity with Generative AI Tools
L. Krupp, N. Wehn. ITG News, April 2025
Improving Chip Design Enablement for Universities in Europe – A Position Paper
L. Krupp, I. O’Connor, L. Benini, C. Studer, J. Rodrigues, N. Wehn. IEEE Conference Design, Automation and Test in Europe (DATE), March, 2025, Lyon, France.
Weitere Publikationen
AIfES: A Next-Generation Edge AI Framework
L. Wulfert, J. Kühnel, L. Krupp, J. Viga, C. Wiede, P. Gembaczka. IEEE Transactions on Pattern Analysis and Machine Intelligence, Volume: 46, Issue: 6, June 2024.
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Hardware Accelerators for a Convolutional Neural Network in Condition Monitoring of CNC Machines
I. Hoyer, O. Berg, L. Krupp, A. Utz, C. Wiede, K. Seidl. IEEE SENSORS, 2023.
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A Cognitive Sensor System Architecture for the Monitoring of Flexible Machining Systems
L. Krupp, C. Wiede, J. Friedhoff, A. Grabmaier. IEEE SENSORS, 2023.
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Explainable Remaining Tool Life Prediction for Individualized Production Using Automated Machine Learning
L. Krupp, C. Wiede, J. Friedhoff, A. Grabmaier. Sensors 2023, 23(20), 8523, 2023.
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The internet is full of things
P. Gembaczka; L. Krupp. Physics Today 76 (7), p54–55, 2023.
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Approximate Fast Fourier Transform-based Preprocessing for Edge AI
L. Krupp, A. Hennig, C. Wiede, A. Grabmaier. IEEE 27th International Conference on Emerging Technologies and Factory Automation (ETFA), November, 2022.
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A Hybrid Framework for Bearing Fault Diagnosis using Physics-guided Neural Networks
L. Krupp, A. Hennig, C. Wiede, A. Grabmaier. 27th IEEE International Conference on Electronics, Circuits and Systems (ICECS), November, 2022.
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